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AMP FROM TE CONNECTIVITY  8134-HC-6P2  IC & Component Socket, HOLTITE Series, Board to Board, 1 Contacts, Gold Plated Contacts

AMP FROM TE CONNECTIVITY 8134-HC-6P2
Technical Data Sheet (185.32KB) EN Peržiūrėti visus techninius dokumentus

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Produktų apžvalga

The HOLTITE series zero profile Solder less DIP Socket designed to be press-fit into the plated through-hole of a printed wiring board. This unique design allows the plated-thru hole to become the component socket. The outer conical shape of the Holtite® contact sizes the plated-thru hole when pressed into place. The precision-machined geometry allows for the controlled displacement of plated material without damaging the hole or affecting the normal mechanical and electrical contact performance. The socketing technique provides the shortest distance between the component seating plane and the contact engagement zone for maximum retention of short component leads. Open contact design permits air flow through the board, increasing heat dissipation and extending component life. Use of the Holtite® solder less system removes certain artwork restrictions necessary for wave soldering and solder joint construction.
  • Lowest socket profile
  • Precision-machined, tapered-entry, four finger contact
  • Retains minimum component lead lengths
  • Solder less, gas-tight, press-fit insertion
  • Immediate conversion to the Holtite® system
  • 10mR Maximum contact resistance

Informacija apie produktą

Product Range:
HOLTITE Series
Connector Type:
Board to Board
No. of Contacts:
1Contacts
Pitch Spacing:
-
Row Pitch:
-
Contact Plating:
Gold Plated Contacts
Contact Material:
Beryllium Copper
SVHC:
To Be Advised

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Pritaikymas

  • Industrial;
  • Aerospace, Defence, Military

Teisinė ir aplinkosaugos informacija

Kilmės šalis:
Switzerland

Šalis, kurioje paskutinį kartą gamintojo atliktas stambus gamybos procesas

RoHS suderinamumas:
Taip
Tarifo nr.:
85366990
Svoris (kg):
.001001

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