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Informacija apie produktą
Produktų apžvalga
MT41K256M16TW-107 IT:P is a DDR3L SDRAM (1.35V) is a low voltage version of the DDR3 (1.5V) SDRAM. DDR3 SDRAM uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is an 8n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR3 SDRAM effectively consists of a single 8n-bit-wide, four-clock cycle data transfer at the internal DRAM core and eight corresponding n-bit-wide, one-half-clock-cycle data transfers at the I/O pins. The differential data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the DDR3 SDRAM input receiver. DQS is centre-aligned with data for WRITEs. The read data is transmitted by the DDR3 SDRAM and edge-aligned to the data strobes. It features Self refresh temperature (SRT), Automatic self refresh (ASR), write levelling, multipurpose register, output driver calibration.
- 32Meg x 16 x 8 banks, 1866MT/s data rate
- 8K refresh count, 32K (A[14:0]) row address, 8 (BA[2:0]) bank address, 1K (A[9:0]) column address
- 1.07ns at CL = 13 (DDR3-1866) timing - cycle time
- VDD = VDDQ = 1.35V (1.283–1.45V) and backward compatible to VDD = VDDQ = 1.5V ±0.075V
- Differential bidirectional data strobe, 8n-bit prefetch architecture, differential clk I/P(CK, CK#)
- 8 internal banks
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Programmable CAS (READ) latency (CL), programmable posted CAS additive latency (AL)
- Programmable CAS (WRITE) latency (CWL)
- Industrial range from -40°C to +95°C and 96-ball (8mm x 14mm) package Rev. P
Techniniai duomenys
DDR3L
256M x 16bit
FBGA
1.35V
-40°C
-
4Gbit
933MHz
96Pins
Surface Mount
95°C
No SVHC (17-Dec-2015)
Techniniai duomenys (1)
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